“Packaging Conclave” by he Bengal Chamber of Commerce & Industry
“Packaging Conclave” by he Bengal Chamber of Commerce & Industry
Bhubaneswar, 5th August 2023: The Bengal Chamber of Commerce & Industry organised “Packaging Conclave” on 4th August, 2023 at Bhubaneswar. The theme was “NextGen Packaging: Smarter, Greener & its Preparedness for Global Play”. Shri Hemant Sharma, IAS, Principal Secretary, Department of Industries, Government of Odisha was the Guest of Honour and delivered the Keynote Address. Shri Hemant Sharma, IAS, Principal Secretary, Government of Odisha mentioned that the plastic and packaging sector is a priority sector in Odisha. He welcomed the investors and assured the investors of a red-carpet welcome in the state.
Mr. Sharma stated that the plastic and packaging industry is treated as an integral part in the state. The plastic and packaging industry is very important for sectors such as food processing sector, agri-retail, apparel etc. and without a robust plastic and packaging sector, these sectors cannot function well. Odisha is a logistically rich state. An extensive mesh of roadways and railways connects the industrial zones to other states facilitating efficient movement of goods and services, making it a destination of choice for industrial enterprises across the country and abroad.
The Industrial Policy Resolution (IPR) 2022 has been formulated to create a conducive and consistent business environment to drive sustainable industrial growth in Odisha. The policy enables timely approval of industrial projects, online single window clearances, dedicated investor facilitation and best-in-class incentives for the plastic and packaging industry also. For investment facilitation in the plastic and packaging sector, the State Government is providing land at concessional rates, capital investment subsidy, employment subsidy, exemptions on electricity duty, stamp duty etc. at a very comparative rate.
The other eminent speakers were Mr. R M Uthayaraja, Director – Manufacturing Business, Balmer Lawrie & Co. Ltd., Mr. P Anand, Mentor, The Next Gen Packaging Committee, BCC&I & VP – M&S, The Tinplate company of India Ltd. , Mr. Ronojoy Basu, Chairman, The Next Gen Packaging Committee, BCC&I & Area Sales Manager, Middle East & South East Asia, Emerson + Renwick Group, Mr. Piyush Mangal, Director Commercial, Signode India Limited, Mr. Ramanathan Balasubramaniam, Head Sales- JSW Tinplate, Mr. Hariharan K Nair, President – Creativity & Innovation, Essel Propak Ltd. and many more.
